Cheng Chen
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Exploring the Optimal Solution for Graphene-Based Microstrip Line Attenuators
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Impact Factor2.3

DOI number:10.1109/TDMR.2025.3578061

Journal:IEEE Transactions on Device and Materials Reliability

Funded by:国际科技合作项目

Abstract:This study explores optimization strategies for the attenuation performance and modulation depth of Graphene-based Microstrip Line Attenuators (GMSLAs). Existing GMSLAs mainly rely on rectangular attenuation units, such as single-layer graphene sheets and graphene composite sandwich structures, which have limitations in meeting diverse performance requirements. To address this, this study systematically investigates which configuration within the same class of structures yields the most optimal and reliable attenuation performance. Using finite element simulations, this study systematically examines the attenuation performance and modulation characteristics of graphene ring-shaped attenuation units with five distinct geometric configurations (circle, regular triangle, square, regular pentagon, and regular hexagon) in the 40-70 GHz V-band. The results indicate that among individual units, the hexagonal unit exhibits the highest average reflection transmission loss and modulation depth. The triangular unit demonstrates a relatively stable and high average reflection transmission loss as well as the most stable modulation depth, whereas the square unit possesses the most stable average reflection transmission loss. Furthermore, by adjusting the rotation angle of the hexagonal units, significant polarization-dependent attenuation was observed. When combining multiple hexagonal units, their performance exceeded the simple sum of individual unit performances, showing superlinear growth. This study overcomes the limitations of traditional graphene attenuation unit designs by introducing a range of geometric configurations, offering new insights into the development of highly efficient, tunable attenuators with superior performance in high-frequency bands.

Discipline:Engineering

First-Level Discipline:Electronic Science and Techonology

Document Type:J

Volume:3

Issue:25

Page Number:617-628

Translation or Not:no

Date of Publication:2025-09-08

Included Journals:SCI

Links to published journals:https://ieeexplore.ieee.org/abstract/document/11029032

First Author:Yuhan Li

Correspondence Author:Cheng Chen*

All the Authors:Jinfeng Liu

All the Authors:Jiaxuan Xue

All the Authors:Jixin Wang

All the Authors:Wu Zhao

All the Authors:Zhiyong Zhang

All the Authors:Johan Stiens

Personal information

Associate professor
Supervisor of Master's Candidates

Name (English):Cheng Chen

Name (Pinyin):chen cheng

E-Mail:

Date of Employment:2021-05-17

School/Department:Northwest University-China (NWU)

Administrative Position:Head of the department

Education Level:With Certificate of Graduation for Doctorate Study

Business Address:Room 205, Informatics Building, Chang'an Campus, Northwest University-China

Contact Information:QQ: 512569826 Email: Cheng.Chen@vub.be; cchen@nwu.edu.cn

Degree:Double Degree

Status:Employed

Academic Titles:Faculty of the Electronics Science and Technology

Other Post:Guest Post-doc Researcher in VUB

Alma Mater:Vrije Universiteit Brussel (VUB); NWU

Discipline:Electrical Circuit and System
Microelectronics and Solid-state Electronics

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